Universal Laser Systems (ULS) is the leading provider of laser material processing solutions and has been advancing the application of laser technology since 1988. Research and Development efforts have resulted in numerous patents, with several pending, in our continual pursuit to develop and enhance laser systems that benefit the customer. Our R&D philosophy and execution are based upon designing highly modular solutions which gives customers the flexibility and investment protection to optimize laser systems as their business evolves.
Universal Laser Systems (ULS) 是激光材料加工解決方案的領先供應商，自 1988 年以來一直在推進激光技術的應用。在我們不斷追求開發和增強激光技術的過程中，研發工作已獲得多項專利，其中多項正在申請中 使客戶受益的系統。 我們的研發理念和執行基於設計高度模塊化的解決方案，為客戶提供靈活性和投資保護，以隨著業務的發展優化激光系統。
VLS2.30DT
A compact and economical entry level platform
Material Processing Envelope:
16 x 12 x 4 in
VLS4.75
A free-standing platform
Material Processing Envelope:
24 x 18 x 8.5 in
PLS6.150D
A free-standing platform that supports dual lasers.
Material Processing Envelope:
32 x 18 x 8.5 in
ULTRA R9000
Platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser.
Material Processing Envelope:
48 x 24 x 12 in
VLS3.60DT
A compact and economical entry level platform
Material Processing Envelope:
24 x 12 x 4 in
VLS6.75
A free-standing platform
Material Processing Envelope:
32 x 18 x 8.5 in
ULTRA R5000
Platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser.
Material Processing Envelope:
32 x 24 x 12 in
ULTRA X6000
Platform offers laser material processing for the widest possible range of materials
Material Processing Envelope:
36 x 24 x 12 in
Laser Cutting Machine
>> VEGA Platform Series
FEATURES
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Equipped with smart carve software and controller, adopts high-speed interpolation movement algorithm to achieve high-speed and stable performance;
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Support Ethernet(10/100M) and USB2.0 transmission;
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Support dynamic display which will show process path and coordinate point, real-time work track display;
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Support work time preview and interruptible engraving recovery after power-off;
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Support laser spot compensation (inward contraction and outward extension), the laser cutting path optimization can be done on software.
